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Modern Solder Technology for Competitive Electronics Manufacturing

Hardcover |English |0070317496 | 9780070317499

Modern Solder Technology for Competitive Electronics Manufacturing

Hardcover |English |0070317496 | 9780070317499
Overview
An impressive, unparalleled reference to the critical manufacturing technology in the electronics and microelectronics industry with real-world applications--a must for all involved in research, production, quality control, and decision-making management. The electronics industry, in its exciting and changing time, ahs responded and continues to respond to the needs of competitive products in the global market place. Today's and future electronics products must deliver faster speeds, lighter weights, smaller sizes at lower cost, and increased durability. It is continuing challenge for manufacturers. This new comprehensive book helps you to meet that challenge and exceed its demands. In it, you will find complete coverage of all relevant technologies that are associated with the application of solder for electronic and microelectraonic packaging and assembly. For the first time, a practical treatment of this interdisciplinary field is given. The book also includes a proper level of underlying fundamentals that are important to the practical applications. The book reflects the author-s belief that value-added industrial applications stem from the synergistic result of a general understanding of a wide spectrum of techniques and practices and an indepth knowledge of a targeted application area. The material is intended to be neither too theoretical for readers with only practical applications in mind nor too descriptive for those who have extensive background in the subject. The ultimate purpose of the book is to provide the industry an integrated source of knowledge and information for implementing a manufacturing system which will produce ever-improved electrical, thermal, and mechanical performance of electronic circuits, covering products from computers and telecommunications to medical devices, weaponry, and household applicances and automobiles. Of the Twenty chapters, highlights include: Market driving forces and benchmark technologies; Surface mount soldering chemistry; Wetting and solderability; No-clean and water-clean manufacturing; Fine pitch technology; Soldering methodologies; Solder joint failure modes and reliability; future prospects and emerging technologies, including flip chip and chip-scale packaging and assembly; Materials characteristics and process troubleshooting; State-of-the-art IC packages; IC lead coating and PCB surface finish; BGA technology; Atmosphere soldering; Lead-free solders; A wealth of data and tables for quick reference; New and revised specifications and standards. Without question, this is the most comprehensive and insightful reference guide for the decade--the one everyone involved in this high-profile, critical manufacturing area should have and use. demands.
ISBN: 0070317496
ISBN13: 9780070317499
Author: Jennie S. Hwang
Publisher: McGraw-Hill Professional
Format: Hardcover
PublicationDate: 1996-04-01
Language: English
Edition: 1
PageCount: 622
Dimensions: 6.3 x 1.56 x 9.0 inches
Weight: 42.24 ounces
An impressive, unparalleled reference to the critical manufacturing technology in the electronics and microelectronics industry with real-world applications--a must for all involved in research, production, quality control, and decision-making management. The electronics industry, in its exciting and changing time, ahs responded and continues to respond to the needs of competitive products in the global market place. Today's and future electronics products must deliver faster speeds, lighter weights, smaller sizes at lower cost, and increased durability. It is continuing challenge for manufacturers. This new comprehensive book helps you to meet that challenge and exceed its demands. In it, you will find complete coverage of all relevant technologies that are associated with the application of solder for electronic and microelectraonic packaging and assembly. For the first time, a practical treatment of this interdisciplinary field is given. The book also includes a proper level of underlying fundamentals that are important to the practical applications. The book reflects the author-s belief that value-added industrial applications stem from the synergistic result of a general understanding of a wide spectrum of techniques and practices and an indepth knowledge of a targeted application area. The material is intended to be neither too theoretical for readers with only practical applications in mind nor too descriptive for those who have extensive background in the subject. The ultimate purpose of the book is to provide the industry an integrated source of knowledge and information for implementing a manufacturing system which will produce ever-improved electrical, thermal, and mechanical performance of electronic circuits, covering products from computers and telecommunications to medical devices, weaponry, and household applicances and automobiles. Of the Twenty chapters, highlights include: Market driving forces and benchmark technologies; Surface mount soldering chemistry; Wetting and solderability; No-clean and water-clean manufacturing; Fine pitch technology; Soldering methodologies; Solder joint failure modes and reliability; future prospects and emerging technologies, including flip chip and chip-scale packaging and assembly; Materials characteristics and process troubleshooting; State-of-the-art IC packages; IC lead coating and PCB surface finish; BGA technology; Atmosphere soldering; Lead-free solders; A wealth of data and tables for quick reference; New and revised specifications and standards. Without question, this is the most comprehensive and insightful reference guide for the decade--the one everyone involved in this high-profile, critical manufacturing area should have and use. demands.

Books - New and Used

The following guidelines apply to books:

  • New: A brand-new copy with cover and original protective wrapping intact. Books with markings of any kind on the cover or pages, books marked as "Bargain" or "Remainder," or with any other labels attached, may not be listed as New condition.
  • Used - Good: All pages and cover are intact (including the dust cover, if applicable). Spine may show signs of wear. Pages may include limited notes and highlighting. May include "From the library of" labels. Shrink wrap, dust covers, or boxed set case may be missing. Item may be missing bundled media.
  • Used - Acceptable: All pages and the cover are intact, but shrink wrap, dust covers, or boxed set case may be missing. Pages may include limited notes, highlighting, or minor water damage but the text is readable. Item may but the dust cover may be missing. Pages may include limited notes and highlighting, but the text cannot be obscured or unreadable.

Note: Some electronic material access codes are valid only for one user. For this reason, used books, including books listed in the Used – Like New condition, may not come with functional electronic material access codes.

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  • Stevens Books offers FREE SHIPPING everywhere in the United States for ALL non-book orders, and $3.99 for each book.
  • Packages are shipped from Monday to Friday.
  • No additional fees and charges.

Delivery Times

The usual time for processing an order is 24 hours (1 business day), but may vary depending on the availability of products ordered. This period excludes delivery times, which depend on your geographic location.

Estimated delivery times:

  • Standard Shipping: 5-8 business days
  • Expedited Shipping: 3-5 business days

Shipping method varies depending on what is being shipped.  

Tracking
All orders are shipped with a tracking number. Once your order has left our warehouse, a confirmation e-mail with a tracking number will be sent to you. You will be able to track your package at all times. 

Damaged Parcel
If your package has been delivered in a PO Box, please note that we are not responsible for any damage that may result (consequences of extreme temperatures, theft, etc.). 

If you have any questions regarding shipping or want to know about the status of an order, please contact us or email to support@stevensbooks.com.

You may return most items within 30 days of delivery for a full refund.

To be eligible for a return, your item must be unused and in the same condition that you received it. It must also be in the original packaging.

Several types of goods are exempt from being returned. Perishable goods such as food, flowers, newspapers or magazines cannot be returned. We also do not accept products that are intimate or sanitary goods, hazardous materials, or flammable liquids or gases.

Additional non-returnable items:

  • Gift cards
  • Downloadable software products
  • Some health and personal care items

To complete your return, we require a tracking number, which shows the items which you already returned to us.
There are certain situations where only partial refunds are granted (if applicable)

  • Book with obvious signs of use
  • CD, DVD, VHS tape, software, video game, cassette tape, or vinyl record that has been opened
  • Any item not in its original condition, is damaged or missing parts for reasons not due to our error
  • Any item that is returned more than 30 days after delivery

Items returned to us as a result of our error will receive a full refund,some returns may be subject to a restocking fee of 7% of the total item price, please contact a customer care team member to see if your return is subject. Returns that arrived on time and were as described are subject to a restocking fee.

Items returned to us that were not the result of our error, including items returned to us due to an invalid or incomplete address, will be refunded the original item price less our standard restocking fees.

If the item is returned to us for any of the following reasons, a 15% restocking fee will be applied to your refund total and you will be asked to pay for return shipping:

  • Item(s) no longer needed or wanted.
  • Item(s) returned to us due to an invalid or incomplete address.
  • Item(s) returned to us that were not a result of our error.

You should expect to receive your refund within four weeks of giving your package to the return shipper, however, in many cases you will receive a refund more quickly. This time period includes the transit time for us to receive your return from the shipper (5 to 10 business days), the time it takes us to process your return once we receive it (3 to 5 business days), and the time it takes your bank to process our refund request (5 to 10 business days).

If you need to return an item, please Contact Us with your order number and details about the product you would like to return. We will respond quickly with instructions for how to return items from your order.


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We'll pay the return shipping costs if the return is a result of our error (you received an incorrect or defective item, etc.). In other cases, you will be responsible for paying for your own shipping costs for returning your item. Shipping costs are non-refundable. If you receive a refund, the cost of return shipping will be deducted from your refund.

Depending on where you live, the time it may take for your exchanged product to reach you, may vary.

If you are shipping an item over $75, you should consider using a trackable shipping service or purchasing shipping insurance. We don’t guarantee that we will receive your returned item.

$17.12

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Overview
An impressive, unparalleled reference to the critical manufacturing technology in the electronics and microelectronics industry with real-world applications--a must for all involved in research, production, quality control, and decision-making management. The electronics industry, in its exciting and changing time, ahs responded and continues to respond to the needs of competitive products in the global market place. Today's and future electronics products must deliver faster speeds, lighter weights, smaller sizes at lower cost, and increased durability. It is continuing challenge for manufacturers. This new comprehensive book helps you to meet that challenge and exceed its demands. In it, you will find complete coverage of all relevant technologies that are associated with the application of solder for electronic and microelectraonic packaging and assembly. For the first time, a practical treatment of this interdisciplinary field is given. The book also includes a proper level of underlying fundamentals that are important to the practical applications. The book reflects the author-s belief that value-added industrial applications stem from the synergistic result of a general understanding of a wide spectrum of techniques and practices and an indepth knowledge of a targeted application area. The material is intended to be neither too theoretical for readers with only practical applications in mind nor too descriptive for those who have extensive background in the subject. The ultimate purpose of the book is to provide the industry an integrated source of knowledge and information for implementing a manufacturing system which will produce ever-improved electrical, thermal, and mechanical performance of electronic circuits, covering products from computers and telecommunications to medical devices, weaponry, and household applicances and automobiles. Of the Twenty chapters, highlights include: Market driving forces and benchmark technologies; Surface mount soldering chemistry; Wetting and solderability; No-clean and water-clean manufacturing; Fine pitch technology; Soldering methodologies; Solder joint failure modes and reliability; future prospects and emerging technologies, including flip chip and chip-scale packaging and assembly; Materials characteristics and process troubleshooting; State-of-the-art IC packages; IC lead coating and PCB surface finish; BGA technology; Atmosphere soldering; Lead-free solders; A wealth of data and tables for quick reference; New and revised specifications and standards. Without question, this is the most comprehensive and insightful reference guide for the decade--the one everyone involved in this high-profile, critical manufacturing area should have and use. demands.
ISBN: 0070317496
ISBN13: 9780070317499
Author: Jennie S. Hwang
Publisher: McGraw-Hill Professional
Format: Hardcover
PublicationDate: 1996-04-01
Language: English
Edition: 1
PageCount: 622
Dimensions: 6.3 x 1.56 x 9.0 inches
Weight: 42.24 ounces
An impressive, unparalleled reference to the critical manufacturing technology in the electronics and microelectronics industry with real-world applications--a must for all involved in research, production, quality control, and decision-making management. The electronics industry, in its exciting and changing time, ahs responded and continues to respond to the needs of competitive products in the global market place. Today's and future electronics products must deliver faster speeds, lighter weights, smaller sizes at lower cost, and increased durability. It is continuing challenge for manufacturers. This new comprehensive book helps you to meet that challenge and exceed its demands. In it, you will find complete coverage of all relevant technologies that are associated with the application of solder for electronic and microelectraonic packaging and assembly. For the first time, a practical treatment of this interdisciplinary field is given. The book also includes a proper level of underlying fundamentals that are important to the practical applications. The book reflects the author-s belief that value-added industrial applications stem from the synergistic result of a general understanding of a wide spectrum of techniques and practices and an indepth knowledge of a targeted application area. The material is intended to be neither too theoretical for readers with only practical applications in mind nor too descriptive for those who have extensive background in the subject. The ultimate purpose of the book is to provide the industry an integrated source of knowledge and information for implementing a manufacturing system which will produce ever-improved electrical, thermal, and mechanical performance of electronic circuits, covering products from computers and telecommunications to medical devices, weaponry, and household applicances and automobiles. Of the Twenty chapters, highlights include: Market driving forces and benchmark technologies; Surface mount soldering chemistry; Wetting and solderability; No-clean and water-clean manufacturing; Fine pitch technology; Soldering methodologies; Solder joint failure modes and reliability; future prospects and emerging technologies, including flip chip and chip-scale packaging and assembly; Materials characteristics and process troubleshooting; State-of-the-art IC packages; IC lead coating and PCB surface finish; BGA technology; Atmosphere soldering; Lead-free solders; A wealth of data and tables for quick reference; New and revised specifications and standards. Without question, this is the most comprehensive and insightful reference guide for the decade--the one everyone involved in this high-profile, critical manufacturing area should have and use. demands.

Books - New and Used

The following guidelines apply to books:

  • New: A brand-new copy with cover and original protective wrapping intact. Books with markings of any kind on the cover or pages, books marked as "Bargain" or "Remainder," or with any other labels attached, may not be listed as New condition.
  • Used - Good: All pages and cover are intact (including the dust cover, if applicable). Spine may show signs of wear. Pages may include limited notes and highlighting. May include "From the library of" labels. Shrink wrap, dust covers, or boxed set case may be missing. Item may be missing bundled media.
  • Used - Acceptable: All pages and the cover are intact, but shrink wrap, dust covers, or boxed set case may be missing. Pages may include limited notes, highlighting, or minor water damage but the text is readable. Item may but the dust cover may be missing. Pages may include limited notes and highlighting, but the text cannot be obscured or unreadable.

Note: Some electronic material access codes are valid only for one user. For this reason, used books, including books listed in the Used – Like New condition, may not come with functional electronic material access codes.

Shipping Fees

  • Stevens Books offers FREE SHIPPING everywhere in the United States for ALL non-book orders, and $3.99 for each book.
  • Packages are shipped from Monday to Friday.
  • No additional fees and charges.

Delivery Times

The usual time for processing an order is 24 hours (1 business day), but may vary depending on the availability of products ordered. This period excludes delivery times, which depend on your geographic location.

Estimated delivery times:

  • Standard Shipping: 5-8 business days
  • Expedited Shipping: 3-5 business days

Shipping method varies depending on what is being shipped.  

Tracking
All orders are shipped with a tracking number. Once your order has left our warehouse, a confirmation e-mail with a tracking number will be sent to you. You will be able to track your package at all times. 

Damaged Parcel
If your package has been delivered in a PO Box, please note that we are not responsible for any damage that may result (consequences of extreme temperatures, theft, etc.). 

If you have any questions regarding shipping or want to know about the status of an order, please contact us or email to support@stevensbooks.com.

You may return most items within 30 days of delivery for a full refund.

To be eligible for a return, your item must be unused and in the same condition that you received it. It must also be in the original packaging.

Several types of goods are exempt from being returned. Perishable goods such as food, flowers, newspapers or magazines cannot be returned. We also do not accept products that are intimate or sanitary goods, hazardous materials, or flammable liquids or gases.

Additional non-returnable items:

  • Gift cards
  • Downloadable software products
  • Some health and personal care items

To complete your return, we require a tracking number, which shows the items which you already returned to us.
There are certain situations where only partial refunds are granted (if applicable)

  • Book with obvious signs of use
  • CD, DVD, VHS tape, software, video game, cassette tape, or vinyl record that has been opened
  • Any item not in its original condition, is damaged or missing parts for reasons not due to our error
  • Any item that is returned more than 30 days after delivery

Items returned to us as a result of our error will receive a full refund,some returns may be subject to a restocking fee of 7% of the total item price, please contact a customer care team member to see if your return is subject. Returns that arrived on time and were as described are subject to a restocking fee.

Items returned to us that were not the result of our error, including items returned to us due to an invalid or incomplete address, will be refunded the original item price less our standard restocking fees.

If the item is returned to us for any of the following reasons, a 15% restocking fee will be applied to your refund total and you will be asked to pay for return shipping:

  • Item(s) no longer needed or wanted.
  • Item(s) returned to us due to an invalid or incomplete address.
  • Item(s) returned to us that were not a result of our error.

You should expect to receive your refund within four weeks of giving your package to the return shipper, however, in many cases you will receive a refund more quickly. This time period includes the transit time for us to receive your return from the shipper (5 to 10 business days), the time it takes us to process your return once we receive it (3 to 5 business days), and the time it takes your bank to process our refund request (5 to 10 business days).

If you need to return an item, please Contact Us with your order number and details about the product you would like to return. We will respond quickly with instructions for how to return items from your order.


Shipping Cost


We'll pay the return shipping costs if the return is a result of our error (you received an incorrect or defective item, etc.). In other cases, you will be responsible for paying for your own shipping costs for returning your item. Shipping costs are non-refundable. If you receive a refund, the cost of return shipping will be deducted from your refund.

Depending on where you live, the time it may take for your exchanged product to reach you, may vary.

If you are shipping an item over $75, you should consider using a trackable shipping service or purchasing shipping insurance. We don’t guarantee that we will receive your returned item.

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